Features Aluminum Die-cast chassis, Fanless design, Front IP65, 1x Internal SD slot, 1x USB 2.0 & 1x USB 3.0, 2x COM, 2x GbE LAN, Capacitive touch screen, 9~36VDC power input with adapter, SSD 32GB (MLC 32G) Windows 7 Professional for Embedded Systems (FES).
Features Aluminum Die-cast chassis, Fanless design, Front IP65, 1x Internal SD slot, 1x USB 2.0 & 1x USB 3.0, 2x COM, 2x GbE LAN, Capacitive touch screen, 9~36VDC power input with adapter, SSD 32GB (MLC 32G) Windows 7 Professional for Embedded Systems (FES).
Features Aluminum Die-cast chassis, Fanless design, Front IP65, 1x Internal SD slot, 1x USB 2.0 & 1x USB 3.0, 2x COM, 2x GbE LAN, Capacitive touch screen, 9~36VDC power input with adapter, SSD 32GB (MLC 32G) Windows 7 Professional for Embedded Systems (FES).
Features Aluminum Die-cast chassis, Fanless design, Front IP65, 1x Internal SD slot, 1x USB 2.0 & 1x USB 3.0, 2x COM, 2x GbE LAN, Capacitive touch screen, 9~36VDC power input with adapter, SSD 32GB (MLC 32G) Windows 7 Professional for Embedded Systems (FES).
Features Aluminum Die-cast chassis, Fanless design, Front IP65, 1x Internal SD slot, 1x USB 2.0 & 1x USB 3.0, 2x COM, 2x GbE LAN, Capacitive touch screen, 9~36VDC power input with adapter, SSD 32GB (MLC 32G) Windows 7 Professional for Embedded Systems (FES)